Frontiers of Embodied Intelligence (FEI) is a premier, fully open-access journal dedicated to the rapidly advancing field of artificial intelligence systems that perceive, reason, and act within physical or virtual environments. This journal aims to bridge the gap between artificial intelligence, robotics, and cognitive science by providing a unified platform for groundbreaking research on agents that learn and interact through physical embodiment. We seek to publish high-impact work that explores foundational models, learning paradigms, multimodal perception, and real-world applications, fostering a community dedicated to developing safe, interactive, and intelligent systems.
Editors-in-Chief
Prof. Tianrui Li, Southwest Jiaotong University, China
Prof. Jie Xu, University of Leeds, UK
Integrated Intelligent Systems publishes research that explores the design, development, and deployment of intelligent systems capable of solving complex problems through the integration of multiple technologies and approaches. The journal highlights the synergy of artificial intelligence, machine learning, data analytics, cognitive computing, and embedded systems in creating robust, adaptive, and context-aware solutions. It emphasizes both theoretical advances and real-world applications across various domains, including cybersecurity, autonomous systems, healthcare, manufacturing, and smart infrastructure.
AI and Digital Ethics is a peer-reviewed journal that explores the ethical, social, and legal dimensions of artificial intelligence and digital technologies. The journal provides a platform for interdisciplinary research and discussion, aiming to promote responsible innovation, inform policy, and enhance understanding of the societal impact of AI and emerging digital tools. Contributions are invited from anyone involved in promoting ethical and responsible development of technology.
Advanced Packaging and Electronic Materials (APEM) is an international, peer-reviewed journal dedicated to publishing high-quality research on advanced materials, technologies, and processes that enable next-generation electronic packaging and integration. The journal focuses on the design, fabrication, characterization, and reliability of materials and structures used in electronic and microelectronic systems, addressing challenges related to performance, miniaturization, thermal management, and system integration.
